first bump翻译

first bump的基本解释

读音: 美: 英:

击掌庆祝:两人或多人用手相碰,以表示庆祝或祝贺。

例句

The first bump is disposed on the first electrode.第一凸块配置于第一 电极上。
The first underfill is filled between the first chip and the second chip in order to wrap the first bump.以及第一底胶,填充在所述第一芯片与所述第二芯片之间,且包覆所述第一凸块;
The second bump is disposed on the substrate, wherein the height of the second bump is higher than the height of the first bump.第二凸块配置于基板上,其中第二凸块的高度高于第一凸块的高度。
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